The collaborative effort, featuring hardware from Sckipio, Civica WanStaX software and the Microsemi WinPath network processor, demonstrated over 3Gbps of download and 1Gbps of upload on production silicon using Gfast bonding running at 212Mhz.
Gfast is the next generation of ultra-fast broadband using the latest innovations in communications to offer customers over 1Gbps speeds using existing copper phone lines.
WanStaX, Civica’s customisable portfolio of software components is accelerating telecommunication manufacturer’s products to market faster and more cost effectively. In addition, Civica’s expert WinPath and embedded services enable the customisation of products at scale, providing the security and financial flexibility customers need to remain competitive.
Eddie Millsopp, Solutions Director at Civica Ireland commented: “We’re delighted that this latest collaboration with Microsemi WinPath and Sckipio has brought about these record-breaking results. We’re constantly developing our expertise to enable the development of next-generation networks for market leaders in the global telecommunications industry.”
Sckipio is the only company to demonstrate standards-compliant, commercially-available Gfast silicon that runs 4Gbps of aggregate traffic on two pairs of CAT-3 wiring. The 212a solution EFM bonds the pairs using Civica WanStaX software and the Microsemi WinPath network processor. The company’s new Amendment 3 Gfast product has now proved it can well exceed the ultrafast performance targets of operators and regulators for the foreseeable future.
“Sckipio is pushing Gfast to astonishing speeds with production silicon,” added David Baum, CEO of Sckipio. “No other Gfast solution delivers end-to-end 212a profile bonding.”
